Applied Materials Acquires NEXX to Bolster Advanced Packaging Capabilities
Applied Materials announced that it will acquire NEXX, ASMPT Limited's business, to expand its advanced packaging portfolio for AI accelerators. This move aims to support AI chipmakers in building larger, more efficient AI accelerators using chiplet-based designs and panel substrates.
Applied Materials has secured a deal to acquire NEXX, a supplier of large-area advanced packaging deposition equipment, from ASMPT Limited . This acquisition is expected to enhance Applied Materials' panel-level advanced packaging portfolio . NEXX will be integrated into Applied Materials to support AI chipmakers in building AI accelerators .
The move is part of Applied Materials' broader strategy to expand its advanced packaging capabilities, driven by the growing demand for AI applications. As technology advances, chipmakers are shifting towards larger panels and AI chip acceleration. This trend will drive the need for improved chip packaging and deposition technologies .
Market observers have noted the strength of the tech sector, particularly growth-leaning stocks like Applied Materials, heading into the quarterly earnings announcement on May 14, 2026 .
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