JetCool Collaborates with Broadcom on AI Chip Liquid Cooling

JetCool, a Flex subsidiary, announced a collaboration with AVGO to deliver single-phase direct-to-chip liquid cooling solutions for next-generation AI XPUs. The partnership combines JetCool's thermal engineering expertise with FLEX's global mass production capabilities and Broadcom's custom AI silicon architecture.

The cooling solution is designed to integrate with Broadcom's mechanical and thermal reference architecture, enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm² per device. As AI training and inference workloads push silicon power densities into sustained multi-kilowatt ranges, thermal architecture has become a critical factor directly impacting system performance, reliability, and deployment timelines.

JetCool provides end-to-end liquid cooling infrastructure — from cold plates and manifolds to coolant distribution units (CDUs) — supported by Flex's manufacturing scale to enable deployment across hyperscale AI environments. The partnership establishes a production-ready thermal foundation as data center operators grapple with the growing power density demands of next-generation AI accelerators.