SK Hynix and Intel Discuss Launching U.S. Memory Chip Production in Ohio

SK Hynix is reportedly in early‑stage talks with Intel to produce memory chips in the United States, with the potential location being Intel's Ohio megafab, according to multiple sources on September 16, 2026. Reports describe the discussions as very early, with the two companies not yet having entered formal negotiations. If it proceeds, the partnership would mark SK Hynix's first manufacturing footprint on U.S. soil and is seen as a strategic move to diversify its production base and meet growing demand for DRAM and NAND products.

The announcement coincided with a notable rise in the stocks of both firms, as investors priced in the anticipated benefits of the collaboration. Shares of SK Hynix and Intel climbed following the reports, with market commentary highlighting the upside for both companies' earnings and the broader semiconductor ecosystem.

Washington has been actively encouraging domestic chip production through incentives and policy measures, and the proposed Ohio venture fits within that broader push to reduce reliance on overseas supply chains and alleviate the ongoing memory crunch. Intel's delayed Ohio megafab, originally slated for a later rollout, could serve as the manufacturing platform for SK Hynix's first U.S. memory chips, potentially accelerating the timeline for both parties.

Analysts suggest that the collaboration could strengthen SK Hynix's position in the high‑performance memory market while giving Intel additional revenue streams from a leading memory supplier. The deal may also influence competitive dynamics with rivals such as Samsung and Micron, who are similarly expanding U.S. capacity. Stakeholders will be watching for formal announcements, detailed terms of the partnership, and any regulatory approvals required for the joint venture.